I already have a fully modelled two-piece enclosure design that was 3-D printed for test-fitting electronics; however, the design was never intended to keep out dust or water. My priority now is to re-engineer that same model so it can be injection-moulded and certified to IP67, with only minor changes to the overall form and mounting points. The critical area is the sealing system. Gasket or O-ring grooves, compression stops, and any required ribs must be added, and the joint detail should be robust enough to withstand temporary immersion. While doing this, the file also needs standard DFM updates—draft angles, uniform wall thickness, sensible parting lines, and reliefs—suitable for ASA resin. Deliverables • Updated 3-D CAD of all parts in native format (SolidWorks preferred) plus STEP/IGES • 2-D drawings showing key dimensions, draft, and tolerances for the toolmaker • Recommended gasket profile/material with compression analysis or clear rationale • Brief DFM/IP67 checklist demonstrating how each ingress path is addressed Final geometry has to be ready for tooling and confidently pass an IP67 dunk test once moulded.